Traceable machine vision systems for digital industrial applications (DI-Vision)
Projects
Traceable machine vision systems for digital industrial applications (DI-Vision)
Machine vision systems are crucial to many high-value industries, where Europe is globally competitive, and to the EU objectives for digital transformation and the Green Deal. However, further work is needed to develop:
- To achieve the traceability of existing and future MVSs in combination with other measuring equipment;
- Develop digital twins of MVSs based on data and physically driven models;
- Implement robust matching and analysis algorithms for large amounts of stored raw data.
The tools developed in this project, combined with uncertainty evaluation methods, will be applied throughout industrial applications on macro‑ and microscale specimens in order to reach better accuracy, productivity and flexibility as well as improved safety and cost efficiency.
Our role
VSL focuses on two types of machine vision solutions for respectively (1) expansion with an optical high-resolution camera on the 3D-CMM and (2) the optical camera on an HF wafer probing station for advanced control and contact detection. The optical camera on the 3D CMM will be developed for calibrations of 2D grid plates and optical reference standards for microscopes. VSL focuses on developing algorithms for image processing, ensuring traceability and drawing up uncertainty budgets. This is supported by the field of Data Science and Modeling. New methods are also being developed that can serve as a basis for adjustments to existing standards for vision systems on coordinate measuring systems. The machine vision for HF wafer probing will be developed for automated checking and determining the quality of the electrical contact based on the print left behind. The VSL probing system is used to collect a data set of plan view images from probe-substrate contact prints. Ground Signal Ground (GSG) probes, with pitch distances of 150 µm, 100 µm, and 50 µm, are used in combination with gold and aluminum substrates. These substrates are then supplied for characterization of the probe footprint by an external partner, in combination with which the dataset of top view images is used to develop algorithms.
Startdatum: September 1, 2024 Einddatum: Augustus 31, 2027
More information on the research project can be found on its web page https://projects.lne.eu/jrp-di-vision/
“The project has received funding from the European Partnership on Metrology, co-financed from the European Union’s Horizon Europe Research and Innovation Programme and by the Participating States.”
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Projects
Our expertise in practice
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This project addresses this issue by developing novel methods to help bridge the metrology gap and in turn foster KET innovation. More specifically, this project will push the boundaries of optical measurement methods by realising a new generation of optical metrology systems, with unprecedented performances in terms of spatial resolution, traceability, reliability and robustness.
Traceable metrology of soft X-ray to IR optical constants and nanofilms for advanced manufacturing (20IND04 ATMOC)
The optics and semiconductor industries use innovative materials and complex nanostructures in their products whose optical properties are difficult to measure and often not accurately known. This project is developping advanced mathematical methods to traceably characterise these materials for wavelength ranges from soft X-ray to IR.
Traceable industrial 3D roughness and dimensional using optical 3D microscopy and optical distance sensors (20IND07 TracOptic)
To remain competitive, European manufacturers strive to make constant improvements in their manufacturing processes. The surface topography of a component part can have a profound effect on the function of the part. This is true across a wide range of industries (such as precision engineering, automotive and medical).
